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Summary:
Monitor and develop supplier quality with best TQRDC (Technology, Quality, Response, Delivery and Cost) performance. 監(jiān)控和提高封裝廠在技術(shù)，質(zhì)量，反饋，交期以及成本方面的表現(xiàn)。
RESPONSIBILITIES:
1. Handle assembly quality issue, verify the root cause and make sure the corrective actions can be implemented effectively and timely to prevent recurrence. 處理封裝質(zhì)量事故，查找原因并協(xié)助封裝供應(yīng)商制定和實(shí)施有效改進(jìn)措施，預(yù)防同類事故再次發(fā)生。
2. Conduct regular audit and have the quarterly performance rating, discuss quality/technical issues with suppliers to support them on continuous improvement and provide reliable product. 完成定期對(duì)封裝供應(yīng)商的審查和季度的評(píng)分，并與其探討以提升質(zhì)量及技術(shù)，協(xié)助他們制定長(zhǎng)期有效的改進(jìn)措施以提供高質(zhì)量產(chǎn)品。
3. Weekly monitor and analyze the assembly yield, defect mode, SPC to assure ongoing quality system capability, and daily check the assembly WIP to ensure the short assembly cycle time and on time delivery. 每周監(jiān)控和分析封裝良率、廢品模式、SPC等以確?？煽康漠a(chǎn)品質(zhì)量，每天查看封裝供應(yīng)商在線產(chǎn)品的狀況以縮短產(chǎn)品封裝周期，保證準(zhǔn)時(shí)交貨。
4. Conduct the risk assessment and have the disposition for wafer incoming issue at supplier and on hold lot with assembly issue at test floor. 完成對(duì)風(fēng)險(xiǎn)產(chǎn)品的評(píng)估，處理在封裝供應(yīng)商處芯片來料問題及測(cè)試線因封裝問題而被扣留的產(chǎn)品。
5. Generate and evaluate supplier quality reports, establish appropriate baseline, determine continuous improvement opportunities. 完成對(duì)封裝供應(yīng)商的評(píng)估報(bào)告以及制定各種封裝特殊要求，提出需持續(xù)改進(jìn)的地方。
6. Coordinates with FA engineers to indentify the assembly failures, addresses the root cause and get the corrective actions with assemblers. 協(xié)助FA工程師分析封裝失效廢品，找到失效原因并與封裝供應(yīng)商一起提出解決措施。
7. Coordinates the qualification of new supplier, materials, package, assembly processes. 協(xié)助對(duì)各種新封裝供應(yīng)商、封裝材料、封裝模式、封裝流程等的評(píng)估。
REQUIREMENTS:
1. Bachelor degree, majoring in Engineering or related discipline. 本科及以上學(xué)歷，工程或相關(guān)專業(yè)。
2. Familiar with general assembly processes and QA controls (8D CAR, FMEA, SPC, etc). 掌握封裝流程以及各種質(zhì)量管控分析方法。
3. Knowledge of basic concepts of FA and reliability. 了解基本的失效分析以及可靠性知識(shí)。
4. Fluent English writing and speaking skills. 流利的英文書寫以及口語(yǔ)。