若無(wú)該機(jī)型崗位經(jīng)驗(yàn),勿擾~
KEY TASKS & RESPONSIBILITIES:
工作職責(zé):
1. Line issue analysis and disposition. 線上異常問(wèn)題分析與處理
2. Assist saw singulation engineer to driving and initiating improvement activities (such as Yield improvement, Cost Saving, UPH and OEE improvement) with cross functional team.協(xié)助SAW工程師推動(dòng)相關(guān)職能部門進(jìn)行改善行動(dòng)(如良率改善,成本節(jié)約,UPH和OEE改善)
3. Assist saw singulation engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.
協(xié)助SAW工程師用DOE方法解決問(wèn)題,能編寫相關(guān)報(bào)告等技能
4.Draw up SOP for line training.制定操作SOP并培訓(xùn)相關(guān)操作人員
5.Assist saw singulation engineer to NPI Eng and Qual lot execution, LVM and HVM support.協(xié)助SAW工程師完成新品導(dǎo)入及工程批生產(chǎn),小批量及批量生產(chǎn)支持.
6.Assist saw singulation engineer to new machine, new uv tape and new saw blade qualification. 協(xié)助SAW工程師驗(yàn)證新設(shè)備,新材料(切割膠紙與刀片)及數(shù)據(jù)收集
7. Provide support on project initiated by others.提供工程項(xiàng)目技術(shù)支持
JOB REQUIREMENTS:
任職資格:
1. Associate Degree or over. 大專或以上學(xué)歷
2. In Material Science, applied Physics, Electron Engineering, Mechanical Engineering or related engineering discipline.材料科學(xué)、應(yīng)用物理、電子工程、機(jī)械工程或相關(guān)工程學(xué)科
3. Over 3 years working experience in related process in semiconductor saw singulation. 至少3年半導(dǎo)體相關(guān)工序經(jīng)驗(yàn)
4. Strong experience in Saw singulation Process (include full cut and half cut).
非常豐富切割工序經(jīng)驗(yàn)(全切割與半切割)
5. Familiar Saw Singulation process related machine, Tape Saw and Jig Saw (such as Disco 6362 etc series, HANMI series, ADT, Rokko 7000S /8000P). 熟悉后道切割工序相關(guān)設(shè)備操作,膠紙與模具切割設(shè)備(如Disco6362等系列, HANMI系列, ADT, ROKKO 7000S / 8000P設(shè)備)
6.A team minded person capable of working independently, keeping a positive attitude.有團(tuán)隊(duì)意識(shí)的人,能夠獨(dú)立工作,保持積極的態(tài)度