To lead and draft the plant for new equipment buyoff/ release.
Closely work with RD, follow new product process development and risk assessment, define the process window to achieve the project target.
Provide technical training to technicians for production support.
OCAP case handle & amp, root cause investigation, daily online quality issue investigation.
Daily sustaining to smooth the normal production.
Standardize the process and documentation FMEA/ control plan/ OCAP/ OPL.
Overall planning the continuous improvement actions.
任職資格:
? Bachelor Degree in Material Science, Applied Physics, Electron Engineering, related engineering discipline.
? Bachelor Degree with at least 3 years working experience in related process in high volume electronics manufacturing environment preferably semiconductor.
? Familiar with package saw process is must.
? Familiar with Disco tape saw DFD641/ DFD6362 and jig saw hanmi 3500S/ Rokko 7000S is preferred.
? A team minded person capable of working independently, keeping a positive attitude.