職位描述
設(shè)計(jì)通信/網(wǎng)絡(luò)設(shè)備智能硬件
Job Responsibilities:
?Responsible for routine PCB layout designs.
?Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design.
?Generate documents per design flow and rules, submit for peer review and attach to file system after that.
?Actively participate in technical discussions at the early design phase.
?Review and verify the layout designs per the checklist for others.
?Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases.
SKILLS/QUALIFICATIONS:
?BS or higher in electrical engineering or equivalent;
?5 years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design;
?In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules;
?Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density;
?At least as an expert in one of PCB design tools, Mentor Pads design experience and Allegro is preferred;
?Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred;
?Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus;
?Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirement.
?Responsible for routine PCB layout designs.
?Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design.
?Generate documents per design flow and rules, submit for peer review and attach to file system after that.
?Actively participate in technical discussions at the early design phase.
?Review and verify the layout designs per the checklist for others.
?Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases.
SKILLS/QUALIFICATIONS:
?BS or higher in electrical engineering or equivalent;
?5 years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design;
?In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules;
?Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density;
?At least as an expert in one of PCB design tools, Mentor Pads design experience and Allegro is preferred;
?Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred;
?Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus;
?Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirement.
工作地點(diǎn)
上海閔行區(qū)浦江鎮(zhèn)地鐵站-1口
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