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ROLE PURPOSE:
Drive Wire Bond process for yield improvement & cost reduction. To guide technician /engineer & provide solutions on process problems using analytical and engineering approach.
KEY TASKS & RESPONSIBILITIES:
· Able to lead a team of engineers with coaching and guiding engineers/technicians.
· Leading, driving and initiating improvement activities (yield & cost reduction) with cross functional team in Wire Bond.
· Guiding engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.
· Interaction with customers.
· Build sheet & design review.
· Drive for all wire bond issues that cannot be solved in line level.
· Provide support on project initiated by others.
JOB REQUIREMENTS:
· 5 years of experience in fast paced semiconductor manufacturing environment,
process engineering
· Independent with minimal supervision.
· Advanced in Microsoft office & Microsoft project. Knowledge in AutoCAD would be preferred.
· SPC/DMAIC.
· Understand and knowledgeable in DOE application routinely uses it in daily problem solving.
· Fluent in spoken & good command in written English.
· Strong knowledge in PFMEA, Control Plan, Process spec, MRB & 8D generation.
· Well verse with machine operation & tooling design function.
· Strong knowledge of JMP/Minitab on data statistics analysis software.