崗位職責:
1.Develop high aspect ratio Si Dry Etching process, and responsible for the process set up, and optimization.
開發(fā)刻蝕(高深寬比)工藝,負責工藝設置、優(yōu)化。
2.Complete micro-structure measurement and data analysis.
完成微結構分析測量和數(shù)據(jù)分析。
3.Extend new equipment to fully release.
擴展新設備到量產(chǎn)。
4.Continuously Improve Process: reduce defect density and improve the process performance.
持續(xù)改進工藝:降低缺陷密度,提高工藝性能。
5.Write technical documents including patent, experiment report, etc.
撰寫專利、實驗報告等技術文件。
6.Organize the process training for engineering.
組織工藝技術培訓。
任職要求:
1.Master’s degree or above in Electronics, Physics, Material Science, Semiconductor or other related science and engineer
碩士及以上學歷,電子、物理、材料科學、半導體或相關科學與工程專業(yè)。
2.At least 3 years of process development or maintenance experience in Dry Etching or DRIE (Deep Reactive Ion Etching) area.
至少3年干法蝕刻或深硅刻蝕(DRIE)的工藝開發(fā)或維護經(jīng)驗。
3.1Familiar with Dry Etching related process and measurement (equipment operation and recipe editing).
熟悉干法蝕刻相關的工藝和測量(包括設備操作和菜單編輯)。
4.Familiar with the configuration and working principle of the Dry Etching platform, and could independently create, modify, and optimize the process recipes.
熟悉干法刻蝕平臺的配置和工作原理,能獨立創(chuàng)建、修改、優(yōu)化工藝菜單。
5.Hands-on ability at dry etching.
較強的干法刻蝕的動手能力。
6.Proficient in office software such as Excel, PPT, etc.
熟練使用Excel、PPT等辦公軟件。
7.Fluent English speaking and writing skill.
流利的英語聽說讀寫能力。
8.Experience in process development in 8-12 inch Fab is preferred.
有8-12英寸工廠工藝開發(fā)經(jīng)驗者優(yōu)先。